NSN 5962-01-358-1168 of Microcircuit Digital - Parts Details
Alternative NSN: 5962013581168 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013581168 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Dla Land And Maritime , National Semiconductor Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54ALS804AJ, 5962-8869301RX, 5962-8869301RB, 5962-8869301RA, 5962-88693 under NSN 5962-01-358-1168 of Microcircuit Digital manufactured by Texas Instrument Inc, Dla Land And Maritime, National Semiconductor Corp.
Federal Supply Class of NSN 5962-01-358-1168 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-358-1168, 5962013581168
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Part No Manufacturer Item Name QTY RFQ SNJ54ALS804AJ Texas Instrument Inc microcircuit digital Avl RFQ 5962-8869301RX Dla Land And Maritime microcircuit digital Avl RFQ 5962-8869301RB Dla Land And Maritime microcircuit digital Avl RFQ 5962-8869301RA Dla Land And Maritime microcircuit digital Avl RFQ 5962-88693 Dla Land And Maritime microcircuit digital Avl RFQ 54ALS804AJ 883 National Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013581168MRC Criteria Characteristic ADAQ BODY LENGTH 1.060 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 66.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN HEX 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 DRIVER, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 12.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 9.00 NANOSECONDS MAXIMUM DELAY TEST TEST DATA DOCUMENT 96909-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT ADAU BODY HEIGHT 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 66.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | HEX 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 6 DRIVER, NAND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 9.00 NANOSECONDS MAXIMUM DELAY |
TEST | TEST DATA DOCUMENT | 96909-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |