NSN 5962-01-360-4027 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013604027 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013604027 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Philips Semiconductors Inc , Advanced Micro Devices Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TIBPAL16R8-15MJB, ROM PROM HEAD 206, PLUS16R8 BRA, PAL16R8DMJ 883B, 5962-8515510RX under NSN 5962-01-360-4027 of Microcircuit Memory manufactured by Texas Instrument Inc, Dla Land And Maritime, Philips Semiconductors Inc, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-360-4027 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-360-4027, 5962013604027
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Part No Manufacturer Item Name QTY RFQ TIBPAL16R8-15MJB Texas Instrument Inc microcircuit memory Avl RFQ ROM PROM HEAD 206 Dla Land And Maritime microcircuit memory Avl RFQ PLUS16R8 BRA Philips Semiconductors Inc microcircuit memory Avl RFQ PAL16R8DMJ 883B Advanced Micro Devices Inc microcircuit memory Avl RFQ 5962-8515510RX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8515510RB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8515510RA Dla Land And Maritime microcircuit memory Avl RFQ 5962-85155 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013604027MRC Criteria Characteristic ADAQ BODY LENGTH 1.060 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.2 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND BIDIRECTIONAL AND BIPOLAR AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR CQZP INPUT CIRCUIT PATTERN 16 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE CWSG TERMINAL SURFACE TREATMENT SOLDER CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY PAL16R8-15 CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CZER MEMORY DEVICE TYPE PAL
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND BIDIRECTIONAL AND BIPOLAR AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | PAL16R8-15 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZER | MEMORY DEVICE TYPE | PAL |