NSN 5962-01-374-2324 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013742324 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013742324 |
| NCB Code: USA (01) |
| Manufacturers: Xilinx Inc , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers XC3030-70PQ100I, XC3030-70PQ1001, SS-365356 under NSN 5962-01-374-2324 of Microcircuit Memory manufactured by Xilinx Inc, Thales Communications Inc.
Federal Supply Class of NSN 5962-01-374-2324 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-374-2324, 5962013742324
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Part No Manufacturer Item Name QTY RFQ XC3030-70PQ100I Xilinx Inc microcircuit memory Avl RFQ XC3030-70PQ1001 Xilinx Inc microcircuit memory Avl RFQ SS-365356 Thales Communications Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013742324MRC Criteria Characteristic AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND PROGRAMMED CQSJ INCLOSURE MATERIAL PLASTIC CQSZ INCLOSURE CONFIGURATION CAN CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE PAL TTQY TERMINAL TYPE AND QUANTITY 100 PIN
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | PAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 100 PIN |