NSN 5962-01-375-2538 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013752538 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013752538 |
| NCB Code: USA (01) |
| Manufacturers: Waferscale Integration Inc , Texas Instrument Inc , Cypress Semiconductor Corporation , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers WS57C49B-45, HE1285A0D006, CY7C263-45DMB, 654907-6 under NSN 5962-01-375-2538 of Microcircuit Memory manufactured by Waferscale Integration Inc, Texas Instrument Inc, Cypress Semiconductor Corporation, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-375-2538 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-375-2538, 5962013752538
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Part No Manufacturer Item Name QTY RFQ WS57C49B-45 Waferscale Integration Inc microcircuit memory Avl RFQ HE1285A0D006 Texas Instrument Inc microcircuit memory Avl RFQ CY7C263-45DMB Cypress Semiconductor Corporation microcircuit memory Avl RFQ 654907-6 Raytheon Aircraft microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013752538MRC Criteria Characteristic ADAQ BODY LENGTH 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" ADAU BODY HEIGHT 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 660.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS" CBBL FEATURES PROVIDED 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 14 INPUT" CTQX CURRENT RATING PER CHARACTERISTIC 120.00 MILLIAMPERES MAXIMUM SUPPLY" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" CZEP CAPITANCE RATING PER CHARACTERISTIC 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM ACCESS" CZER MEMORY DEVICE TYPE EPROM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT" ADAQ BODY LENGTH 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" ADAU BODY HEIGHT 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 660.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS" CBBL FEATURES PROVIDED 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 14 INPUT" CTQX CURRENT RATING PER CHARACTERISTIC 120.00 MILLIAMPERES MAXIMUM SUPPLY" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" CZEP CAPITANCE RATING PER CHARACTERISTIC 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM ACCESS" CZER MEMORY DEVICE TYPE EPROM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 660.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 660.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |