NSN 5962-01-380-6218 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013806218 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013806218 |
| NCB Code: USA (01) |
| Manufacturers: Xilinx Inc , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers XC3090-70PG175I0041, XC3090-70PG175B, 5962-8982302XXX, 5962-8982302XX, 5962-8982302XC under NSN 5962-01-380-6218 of Microcircuit Memory manufactured by Xilinx Inc, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-380-6218 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-380-6218, 5962013806218
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Part No Manufacturer Item Name QTY RFQ XC3090-70PG175I0041 Xilinx Inc microcircuit memory Avl RFQ XC3090-70PG175B Xilinx Inc microcircuit memory Avl RFQ 5962-8982302XXX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8982302XX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8982302XC Dla Land And Maritime microcircuit memory Avl RFQ 5962-8982302XB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8982302XA Dla Land And Maritime microcircuit memory Avl RFQ 5962-8982302MXC Dla Land And Maritime microcircuit memory Avl RFQ 5962-89823 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013806218MRC Criteria Characteristic CZER Memory Device Type PAL TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CQSJ Inclosure Material CERAMIC CBBL Features Provided BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE PMLC Precious Material And Location TERMINALS GOLD CQZP Input Circuit Pattern 64 INPUT AND 10 INPUT CWSG Terminal Surface Treatment GOLD CQSZ Inclosure Configuration LEADED CHIP CARRIER AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS PRMT Precious Material GOLD AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS TTQY Terminal Type And Quantity 175 FLAT LEADS CQWX Output Logic Form COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE MRC Decoded Requirement Clear Text Reply
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | Memory Device Type | PAL |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSJ | Inclosure Material | CERAMIC |
| CBBL | Features Provided | BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE |
| PMLC | Precious Material And Location | TERMINALS GOLD |
| CQZP | Input Circuit Pattern | 64 INPUT AND 10 INPUT |
| CWSG | Terminal Surface Treatment | GOLD |
| CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| PRMT | Precious Material | GOLD |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| TTQY | Terminal Type And Quantity | 175 FLAT LEADS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| MRC | Decoded Requirement | Clear Text Reply |