NSN 5962-01-384-1976 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013841976 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013841976 |
| NCB Code: USA (01) |
| Manufacturers: Philips Semiconductors Inc , Fluke Corporation , Fairchild Semiconductor Corp , Dla Land And Maritime , Telephonics Corporation , Thales Training And Simulation Inc , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers I74F112N, 781211, 74F112PCQR, 74F112N, 5962-9060602EX under NSN 5962-01-384-1976 of Microcircuit Digital manufactured by Philips Semiconductors Inc, Fluke Corporation, Fairchild Semiconductor Corp, Dla Land And Maritime, Telephonics Corporation.
Federal Supply Class of NSN 5962-01-384-1976 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-384-1976, 5962013841976
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Part No Manufacturer Item Name QTY RFQ I74F112N Philips Semiconductors Inc microcircuit digital Avl RFQ 781211 Fluke Corporation microcircuit digital Avl RFQ 74F112PCQR Fairchild Semiconductor Corp microcircuit digital Avl RFQ 74F112N Philips Semiconductors Inc microcircuit digital Avl RFQ 5962-9060602EX Dla Land And Maritime microcircuit digital Avl RFQ 5962-9060602EC Dla Land And Maritime microcircuit digital Avl RFQ 5962-9060602EB Dla Land And Maritime microcircuit digital Avl RFQ 5962-9060602EA Dla Land And Maritime microcircuit digital Avl RFQ 5962-90606 Dla Land And Maritime microcircuit digital Avl RFQ 54F112 BEA Philips Semiconductors Inc microcircuit digital Avl RFQ 513114-1 Telephonics Corporation microcircuit digital Avl RFQ 4024272-001 Thales Training And Simulation Inc microcircuit digital Avl RFQ 10136762 Paeaeesikunta Logistiikkaosasto microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013841976MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM" ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" ADAU BODY HEIGHT 0.198 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 104.5 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CSSL DESIGN FUNCTION AND QUANTITY 2 FLIP-FLOP, J-K" CTQX CURRENT RATING PER CHARACTERISTIC 30.00 MILLIAMPERES COLLECTOR CUTOFF CURRENT, DC, WITH SPECIFIED RESISTANCE BETWEEN BASE AND EMITTER MICROAMPERES AND 5.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" CZEQ TIME RATING PER CHACTERISTIC 5.00 NANOSECONDS MINIMUM RECOVERY" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT" ZZZK SPECIFICATION/STANDARD DATA 81349-MIL-M-38510J GOVERNMENT SPECIFICATION" ADAQ BODY LENGTH 0.840 INCHES MAXIMUM" ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" ADAU BODY HEIGHT 0.198 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 104.5 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CSSL DESIGN FUNCTION AND QUANTITY 2 FLIP-FLOP, J-K" CTQX CURRENT RATING PER CHARACTERISTIC 30.00 MILLIAMPERES COLLECTOR CUTOFF CURRENT, DC, WITH SPECIFIED RESISTANCE BETWEEN BASE AND EMITTER MICROAMPERES AND 5.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" CZEQ TIME RATING PER CHACTERISTIC 5.00 NANOSECONDS MINIMUM RECOVERY" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT" ZZZK SPECIFICATION/STANDARD DATA 81349-MIL-M-38510J GOVERNMENT SPECIFICATION"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.198 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 104.5 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES COLLECTOR CUTOFF CURRENT, DC, WITH SPECIFIED RESISTANCE BETWEEN BASE AND EMITTER MICROAMPERES AND 5.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZEQ | TIME RATING PER CHACTERISTIC | 5.00 NANOSECONDS MINIMUM RECOVERY" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT" |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510J GOVERNMENT SPECIFICATION" |
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.198 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 104.5 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES COLLECTOR CUTOFF CURRENT, DC, WITH SPECIFIED RESISTANCE BETWEEN BASE AND EMITTER MICROAMPERES AND 5.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZEQ | TIME RATING PER CHACTERISTIC | 5.00 NANOSECONDS MINIMUM RECOVERY" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT" |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510J GOVERNMENT SPECIFICATION" |