NSN 5962-01-389-6016 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013896016 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013896016 |
| NCB Code: USA (01) |
| Manufacturers: Austin Semiconductor Inc , White Electronic Designs Corporation , Dla Land And Maritime , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MT5C1008CW-120883C, EDI88130CX45CB, EDI88130CS120CB, 5962-8959830MXX, 5962-8959830MXB under NSN 5962-01-389-6016 of Microcircuit Memory manufactured by Austin Semiconductor Inc, White Electronic Designs Corporation, Dla Land And Maritime, Thales Communications Inc.
Federal Supply Class of NSN 5962-01-389-6016 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-389-6016, 5962013896016
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Part No Manufacturer Item Name QTY RFQ MT5C1008CW-120883C Austin Semiconductor Inc microcircuit memory Avl RFQ EDI88130CX45CB White Electronic Designs Corporation microcircuit memory Avl RFQ EDI88130CS120CB White Electronic Designs Corporation microcircuit memory Avl RFQ 5962-8959830MXX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8959830MXB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8959830MXA Dla Land And Maritime microcircuit memory Avl RFQ 5962-89598 Dla Land And Maritime microcircuit memory Avl RFQ 115811-0030 Thales Communications Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013896016MRC Criteria Characteristic AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS" AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION INSTRUMENT LANDING SYSTEM 2&3" CBBL FEATURES PROVIDED MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER" CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, MONOLITHIC SILICON" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" CZER MEMORY DEVICE TYPE RAM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT" AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS" AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION INSTRUMENT LANDING SYSTEM 2&3" CBBL FEATURES PROVIDED MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER" CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, MONOLITHIC SILICON" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" CZER MEMORY DEVICE TYPE RAM" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT"
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | INSTRUMENT LANDING SYSTEM 2&3" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | INSTRUMENT LANDING SYSTEM 2&3" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | RAM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT" |