NSN 5962-01-391-0610 of Microcircuit Memory - Parts Details
Alternative NSN: 5962013910610 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013910610 |
NCB Code: USA (01) |
Manufacturers: Litton Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 7136341-18-701 under NSN 5962-01-391-0610 of Microcircuit Memory manufactured by Litton Systems Inc.
Federal Supply Class of NSN 5962-01-391-0610 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-391-0610, 5962013910610
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Part No Manufacturer Item Name QTY RFQ 7136341-18-701 Litton Systems Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013910610MRC Criteria Characteristic TTQY Terminal Type And Quantity 20 FLAT LEADS AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS MRC Decoded Requirement Clear Text Reply CQZP Input Circuit Pattern 16 INPUT CQSJ Inclosure Material CERAMIC AND GLASS ADAT Body Width 0.300 INCHES MAXIMUM TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CBBL Features Provided HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS FEAT Special Features ESD, SOFTWARE FILE NO: 8907815-5-701, USING MODULE CPU/RC-8905830-505,LOCATION U42 ADAQ Body Length 0.540 INCHES MAXIMUM AEHX Maximum Power Dissipation Rating 1.0 WATTS ADAU Body Height 0.092 INCHES MAXIMUM CTFT Case Outline Source And Designator F-9 MIL-M-38510 CQSZ Inclosure Configuration FLAT PACK AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS CWSG Terminal Surface Treatment SOLDER CZEQ Time Rating Per Chacteristic 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZER Memory Device Type PAL CQWX Output Logic Form TRANSISTOR-TRANSISTOR LOGIC CRTL Criticality Code Justification FEAT
MRC | Criteria | Characteristic |
---|---|---|
TTQY | Terminal Type And Quantity | 20 FLAT LEADS |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
MRC | Decoded Requirement | Clear Text Reply |
CQZP | Input Circuit Pattern | 16 INPUT |
CQSJ | Inclosure Material | CERAMIC AND GLASS |
ADAT | Body Width | 0.300 INCHES MAXIMUM |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CBBL | Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
FEAT | Special Features | ESD, SOFTWARE FILE NO: 8907815-5-701, USING MODULE CPU/RC-8905830-505,LOCATION U42 |
ADAQ | Body Length | 0.540 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.092 INCHES MAXIMUM |
CTFT | Case Outline Source And Designator | F-9 MIL-M-38510 |
CQSZ | Inclosure Configuration | FLAT PACK |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CWSG | Terminal Surface Treatment | SOLDER |
CZEQ | Time Rating Per Chacteristic | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | Memory Device Type | PAL |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
CRTL | Criticality Code Justification | FEAT |