NSN 5962-01-399-5371 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013995371 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013995371 |
| NCB Code: USA (01) |
| Manufacturers: Giga Tronics Inc , Texas Instrument Inc , National Semiconductor Corp , Freescale Semiconductor Inc , Hewlett Packard Co , Agilent Technologies Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UTD0-05732, SN74HC573ADW, MM74HC573WM, MC74HC573ADW, 1820-5732 under NSN 5962-01-399-5371 of Microcircuit Digital manufactured by Giga Tronics Inc, Texas Instrument Inc, National Semiconductor Corp, Freescale Semiconductor Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-399-5371 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-399-5371, 5962013995371
-
Part No Manufacturer Item Name QTY RFQ UTD0-05732 Giga Tronics Inc microcircuit digital Avl RFQ SN74HC573ADW Texas Instrument Inc microcircuit digital Avl RFQ MM74HC573WM National Semiconductor Corp microcircuit digital Avl RFQ MC74HC573ADW Freescale Semiconductor Inc microcircuit digital Avl RFQ 1820-5732 Hewlett Packard Co microcircuit digital Avl RFQ 1820-5732 Agilent Technologies Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013995371MRC Criteria Characteristic ADAQ BODY LENGTH 0.496 INCHES MINIMUM AND 0.512 INCHES MAXIMUM" ADAT BODY WIDTH 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM" ADAU BODY HEIGHT 0.101 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -25.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HIGH PERFORMANCE AND W/ENABLE AND HIGH IMPEDANCE" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 9 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 8 LATCH" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY NONINVERTING TRANSPARENT LATCH" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" TTQY TERMINAL TYPE AND QUANTITY 20 GULLWING" ADAQ BODY LENGTH 0.496 INCHES MINIMUM AND 0.512 INCHES MAXIMUM" ADAT BODY WIDTH 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM" ADAU BODY HEIGHT 0.101 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -25.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HIGH PERFORMANCE AND W/ENABLE AND HIGH IMPEDANCE" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 9 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 8 LATCH" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY NONINVERTING TRANSPARENT LATCH" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" TTQY TERMINAL TYPE AND QUANTITY 20 GULLWING"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.496 INCHES MINIMUM AND 0.512 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.101 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -25.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HIGH PERFORMANCE AND W/ENABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 LATCH" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | NONINVERTING TRANSPARENT LATCH" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 GULLWING" |
| ADAQ | BODY LENGTH | 0.496 INCHES MINIMUM AND 0.512 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.291 INCHES MINIMUM AND 0.300 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.101 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -25.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HIGH PERFORMANCE AND W/ENABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 LATCH" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | NONINVERTING TRANSPARENT LATCH" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 GULLWING" |