NSN 5962-01-460-9459 of Microcircuit Digital - Parts Details
Alternative NSN: 5962014609459 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 014609459 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Dla Land And Maritime , National Semiconductor Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54ABT541J, 5962-9471801QRX, 5962-9471801QRB, 5962-9471801QRA, 5962-94718 under NSN 5962-01-460-9459 of Microcircuit Digital manufactured by Texas Instrument Inc, Dla Land And Maritime, National Semiconductor Corp.
Federal Supply Class of NSN 5962-01-460-9459 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-460-9459, 5962014609459
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Part No Manufacturer Item Name QTY RFQ SNJ54ABT541J Texas Instrument Inc microcircuit digital Avl RFQ 5962-9471801QRX Dla Land And Maritime microcircuit digital Avl RFQ 5962-9471801QRB Dla Land And Maritime microcircuit digital Avl RFQ 5962-9471801QRA Dla Land And Maritime microcircuit digital Avl RFQ 5962-94718 Dla Land And Maritime microcircuit digital Avl RFQ 54ABT541J-QML National Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962014609459MRC Criteria Characteristic AEHX MAXIMUM POWER DISSIPATION RATING 5000.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION ELECTRICAL E/I FSCM 81349" CBBL FEATURES PROVIDED MONOLITHIC AND 3-STATE OUTPUT" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR" CSSL DESIGN FUNCTION AND QUANTITY 1 BUFFER, TRI-STATE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER / NONINVERTING THREE-STATE OUTPUTS, TTL COMP INPUTS, MONOLITHIC SILICON" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" TEST TEST DATA DOCUMENT 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT" AEHX MAXIMUM POWER DISSIPATION RATING 5000.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" AGAV END ITEM IDENTIFICATION ELECTRICAL E/I FSCM 81349" CBBL FEATURES PROVIDED MONOLITHIC AND 3-STATE OUTPUT" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR" CSSL DESIGN FUNCTION AND QUANTITY 1 BUFFER, TRI-STATE" CWSG TERMINAL SURFACE TREATMENT SOLDER" CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER / NONINVERTING THREE-STATE OUTPUTS, TTL COMP INPUTS, MONOLITHIC SILICON" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" TEST TEST DATA DOCUMENT 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT"
MRC | Criteria | Characteristic |
---|---|---|
AEHX | MAXIMUM POWER DISSIPATION RATING | 5000.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ELECTRICAL E/I FSCM 81349" |
CBBL | FEATURES PROVIDED | MONOLITHIC AND 3-STATE OUTPUT" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 BUFFER, TRI-STATE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER / NONINVERTING THREE-STATE OUTPUTS, TTL COMP INPUTS, MONOLITHIC SILICON" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 5000.0 MILLIWATTS" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
AGAV | END ITEM IDENTIFICATION | ELECTRICAL E/I FSCM 81349" |
CBBL | FEATURES PROVIDED | MONOLITHIC AND 3-STATE OUTPUT" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 BUFFER, TRI-STATE" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER / NONINVERTING THREE-STATE OUTPUTS, TTL COMP INPUTS, MONOLITHIC SILICON" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT" |