91L02DM-B by Advanced Micro Devices Inc with NSN 5962010436195 - Submit a Quote
| Part No. : 91L02DM-B | Alternate P/N: 91L02DMB | Manufacturer : Advanced Micro Devices Inc | NSN : 5962-01-043-6195 |
| Item Name : Microcircuit Memory | CAGE Code : 34335 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 91L02DM-B of NSN 5962010436195 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 91L02DM-B is a microcircuit memory manufactured by advanced micro devices inc under CAGE Code 34335. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 91L02DM-B advanced micro devices inc is in stock.
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NSN Information for Part Number 91L02DM-B with NSN 5962-01-043-6195, 5962010436195
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-043-6195 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010436195 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91L02DM-B | 3 | 9 | 5 |
Characteristics Data of NSN 5962-01-043-6195, 5962010436195MRC Criteria Characteristic CZEQ Time Rating Per Chacteristic 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER Memory Device Type RAM AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS CQZP Input Circuit Pattern 13 INPUT ADAT Body Width 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM CQSJ Inclosure Material CERAMIC AND GLASS TTQY Terminal Type And Quantity 16 PRINTED CIRCUIT CWSG Terminal Surface Treatment SOLDER CBBL Features Provided HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT ADAQ Body Length 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM AEHX Maximum Power Dissipation Rating 260.0 MILLIWATTS ADAU Body Height 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). MRC Decoded Requirement Clear Text Reply CQSZ Inclosure Configuration DUAL-IN-LINE AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS CQWX Output Logic Form N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic 7.0 VOLTS MAXIMUM POWER SOURCE CZZZ Memory Capacity UNKNOWN
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 13 INPUT |
| ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
| ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
| ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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