08757-60098 by Agilent Technologies Inc with NSN 5962013805333 - Submit a Quote
| Part No. : 08757-60098 | Alternate P/N: 0875760098 | Manufacturer : Agilent Technologies Inc | NSN : 5962-01-380-5333 |
| Item Name : Microcircuit Set | CAGE Code : 1LQK8 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 08757-60098 of NSN 5962013805333 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 08757-60098 is a microcircuit set manufactured by agilent technologies inc under CAGE Code 1LQK8. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 08757-60098 agilent technologies inc is in stock.
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NSN Information for Part Number 08757-60098 with NSN 5962-01-380-5333, 5962013805333
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-380-5333 Item Description: Microcircuit Set | 5962 | 013805333 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 08757-60098 | 5 | 2 | 3 |
Characteristics Data of NSN 5962-01-380-5333, 5962013805333MRC Criteria Characteristic ADAQ BODY LENGTH 1.625 INCHES NOMINAL ALL MEMORY" ADAT BODY WIDTH 0.562 INCHES NOMINAL ALL MEMORY" ADAU BODY HEIGHT 0.187 INCHES NOMINAL ALL MEMORY" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS ALL MEMORY" ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED" CBBL FEATURES PROVIDED PROGRAMMED" CQSJ INCLOSURE MATERIAL CERAMIC ALL MEMORY" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE ALL MEMORY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER ERR-100 ERR-100" CZEM MICROCIRCUIT DEVICE TYPE AND QUANTITY 2 MEMORY" CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" CZER MEMORY DEVICE TYPE PROM ERR-100 ERR-100" TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT ALL MEMORY" ADAQ BODY LENGTH 1.625 INCHES NOMINAL ALL MEMORY" ADAT BODY WIDTH 0.562 INCHES NOMINAL ALL MEMORY" ADAU BODY HEIGHT 0.187 INCHES NOMINAL ALL MEMORY" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS ALL MEMORY" ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED" CBBL FEATURES PROVIDED PROGRAMMED" CQSJ INCLOSURE MATERIAL CERAMIC ALL MEMORY" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE ALL MEMORY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" CRHL UNABLE TO DECODE UNABLE TO DECODE" CSWJ UNABLE TO DECODE UNABLE TO DECODE" CWSG TERMINAL SURFACE TREATMENT SOLDER ERR-100 ERR-100" CZEM MICROCIRCUIT DEVICE TYPE AND QUANTITY 2 MEMORY" CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" CZER MEMORY DEVICE TYPE PROM ERR-100 ERR-100" TTQY TERMINAL TYPE AND QUANTITY 32 PRINTED CIRCUIT ALL MEMORY"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.625 INCHES NOMINAL ALL MEMORY" |
| ADAT | BODY WIDTH | 0.562 INCHES NOMINAL ALL MEMORY" |
| ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL ALL MEMORY" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS ALL MEMORY" |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED" |
| CBBL | FEATURES PROVIDED | PROGRAMMED" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC ALL MEMORY" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE ALL MEMORY" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" |
| CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
| CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER ERR-100 ERR-100" |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY" |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" |
| CZER | MEMORY DEVICE TYPE | PROM ERR-100 ERR-100" |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT ALL MEMORY" |
| ADAQ | BODY LENGTH | 1.625 INCHES NOMINAL ALL MEMORY" |
| ADAT | BODY WIDTH | 0.562 INCHES NOMINAL ALL MEMORY" |
| ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL ALL MEMORY" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS ALL MEMORY" |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED" |
| CBBL | FEATURES PROVIDED | PROGRAMMED" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC ALL MEMORY" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE ALL MEMORY" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC ALL MEMORY" |
| CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
| CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER ERR-100 ERR-100" |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY" |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS ALL MEMORY" |
| CZER | MEMORY DEVICE TYPE | PROM ERR-100 ERR-100" |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT ALL MEMORY" |
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