89014076 by Drs Training And Control Systems Llc with NSN 5962013761633 - Submit a Quote
| Part No. : 89014076 | Manufacturer : Drs Training And Control Systems Llc | NSN : 5962-01-376-1633 |
| Item Name : Microcircuit Memory | CAGE Code : 12339 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 89014076 of NSN 5962013761633 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 89014076 is a microcircuit memory manufactured by drs training and control systems llc under CAGE Code 12339. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 89014076 drs training and control systems llc is in stock.
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NSN Information for Part Number 89014076 with NSN 5962-01-376-1633, 5962013761633
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-376-1633 Item Description: Microcircuit Memory | 5962 | 013761633 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 89014076 | 5 | 2 | 3 |
Characteristics Data of NSN 5962-01-376-1633, 5962013761633MRC Criteria Characteristic CTQX Current Rating Per Characteristic 1.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES CQWX Output Logic Form TRANSISTOR-TRANSISTOR LOGIC CBBL Features Provided BIPOLAR AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND W/CLOCK AND BIDIRECTIONAL AND 3-STATE OUTPUT AND PROGRAMMED AND ELECTROSTATIC SENSITIVE TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CQZP Input Circuit Pattern 12 INPUT CQSJ Inclosure Material CERAMIC ADAT Body Width 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM CWSG Terminal Surface Treatment SOLDER AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS ADAQ Body Length 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM CQSZ Inclosure Configuration LEADLESS FLAT PACK MRC Decoded Requirement Clear Text Reply AEHX Maximum Power Dissipation Rating 1.1 WATTS CXCY Part Name Assigned By Controlling Agency REGISTERED AND-OR GATE ARRAY - PAL CPU IO SELECT CTFT Case Outline Source And Designator C-2 MIL-M-38510 TTQY Terminal Type And Quantity 20 LEADLESS CZEQ Time Rating Per Chacteristic 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZER Memory Device Type PAL AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS
| MRC | Criteria | Characteristic |
|---|---|---|
| CTQX | Current Rating Per Characteristic | 1.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES |
| CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| CBBL | Features Provided | BIPOLAR AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND W/CLOCK AND BIDIRECTIONAL AND 3-STATE OUTPUT AND PROGRAMMED AND ELECTROSTATIC SENSITIVE |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQZP | Input Circuit Pattern | 12 INPUT |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CWSG | Terminal Surface Treatment | SOLDER |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| ADAQ | Body Length | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| MRC | Decoded Requirement | Clear Text Reply |
| AEHX | Maximum Power Dissipation Rating | 1.1 WATTS |
| CXCY | Part Name Assigned By Controlling Agency | REGISTERED AND-OR GATE ARRAY - PAL CPU IO SELECT |
| CTFT | Case Outline Source And Designator | C-2 MIL-M-38510 |
| TTQY | Terminal Type And Quantity | 20 LEADLESS |
| CZEQ | Time Rating Per Chacteristic | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | Memory Device Type | PAL |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
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