TXV3188 by Hewlett Packard Co with NSN 5961010642504 - Submit a Quote
Part No. : TXV3188 | Manufacturer : Hewlett Packard Co | NSN : 5961-01-064-2504 |
Item Name : Semiconductor Device Diode | CAGE Code : 54893 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number TXV3188 of NSN 5961010642504 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number TXV3188 is a semiconductor device diode manufactured by hewlett packard co under CAGE Code 54893. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. TXV3188 hewlett packard co is in stock.
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NSN Information for Part Number TXV3188 with NSN 5961-01-064-2504, 5961010642504
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-064-2504 Item Description: Semiconductor Device Diode | 5961 | 010642504 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Txv3188 | 5 | 1 | C | A |
Characteristics Data of NSN 5961-01-064-2504, 5961010642504MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 1.150 INCHES MINIMUM AND 1.170 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES NOMINAL ADAV OVERALL DIAMETER 1.730 INCHES MINIMUM AND 1.930 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 35.0 MAXIMUM BREAKDOWN VOLTAGE, DC CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 1.150 INCHES MINIMUM AND 1.170 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES NOMINAL |
ADAV | OVERALL DIAMETER | 1.730 INCHES MINIMUM AND 1.930 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 35.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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