TXV-3001 by Hewlett Packard Co with NSN 5961012903852 - Submit a Quote
| Part No. : TXV-3001 | Alternate P/N: TXV3001 | Manufacturer : Hewlett Packard Co | NSN : 5961-01-290-3852 |
| Item Name : Semiconductor Device Diode | CAGE Code : 28480 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number TXV-3001 of NSN 5961012903852 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number TXV-3001 is a semiconductor device diode manufactured by hewlett packard co under CAGE Code 28480. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. TXV-3001 hewlett packard co is in stock.
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NSN Information for Part Number TXV-3001 with NSN 5961-01-290-3852, 5961012903852
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-290-3852 Item Description: Semiconductor Device Diode | 5961 | 012903852 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Txv-3001 | 2 | 9 | 5 |
Characteristics Data of NSN 5961-01-290-3852, 5961012903852MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM AFZC FUNCTION FOR WHICH DESIGNED SWITCHING AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 200.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS AND 1.0 MAXIMUM FORWARD VOLTAGE, DC CTQX CURRENT RATING PER CHARACTERISTIC 100.00 NANOAMPERES FORWARD CURRENT, AVERAGE OUTSIDE DIAMETER CTRD POWER RATING PER CHARACTERISTIC 250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET CTRG CAPACITANCE RATING IN PICOFARADS 0.25 MAXIMUM CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM |
| AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS AND 1.0 MAXIMUM FORWARD VOLTAGE, DC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 NANOAMPERES FORWARD CURRENT, AVERAGE OUTSIDE DIAMETER |
| CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.25 MAXIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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