7136341-16-701 by Litton Systems Inc with NSN 5962013910609 - Submit a Quote
| Part No. : 7136341-16-701 | Alternate P/N: 713634116701 | Manufacturer : Litton Systems Inc | NSN : 5962-01-391-0609 |
| Item Name : Microcircuit Memory | CAGE Code : 17863 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 7136341-16-701 of NSN 5962013910609 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 7136341-16-701 is a microcircuit memory manufactured by litton systems inc under CAGE Code 17863. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 7136341-16-701 litton systems inc is in stock.
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NSN Information for Part Number 7136341-16-701 with NSN 5962-01-391-0609, 5962013910609
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-391-0609 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013910609 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 7136341-16-701 | 5 | 9 | 3 |
Characteristics Data of NSN 5962-01-391-0609, 5962013910609MRC Criteria Characteristic ADAQ BODY LENGTH 0.540 INCHES MAXIMUM" ADAT BODY WIDTH 0.300 INCHES MAXIMUM" ADAU BODY HEIGHT 0.092 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS" CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 16 INPUT" CRTL CRITICALITY CODE JUSTIFICATION FEAT" CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-9 MIL-M-38510" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" CZER MEMORY DEVICE TYPE PAL" FEAT SPECIAL FEATURES ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS" ADAQ BODY LENGTH 0.540 INCHES MAXIMUM" ADAT BODY WIDTH 0.300 INCHES MAXIMUM" ADAU BODY HEIGHT 0.092 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS" CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 16 INPUT" CRTL CRITICALITY CODE JUSTIFICATION FEAT" CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-9 MIL-M-38510" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" CZER MEMORY DEVICE TYPE PAL" FEAT SPECIAL FEATURES ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.092 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT" |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS" |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.092 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT" |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | ESD, SOFTWARE FILE NO: 8907815-4-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U327" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS" |
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