217-0006-030 by Rockwell Collins Inc with NSN 5961013430512 - Submit a Quote
| Part No. : 217-0006-030 | Alternate P/N: 2170006030 | Manufacturer : Rockwell Collins Inc | NSN : 5961-01-343-0512 |
| Item Name : Semiconductor Devices Unitized | CAGE Code : 13499 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number 217-0006-030 of NSN 5961013430512 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 217-0006-030 is a semiconductor devices unitized manufactured by rockwell collins inc under CAGE Code 13499. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 217-0006-030 rockwell collins inc is in stock.
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NSN Information for Part Number 217-0006-030 with NSN 5961-01-343-0512, 5961013430512
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-343-0512 Item Description: Semiconductor Devices Unitized | 5961 | 013430512 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 217-0006-030 | 5 | 2 | 3 |
Characteristics Data of NSN 5961-01-343-0512, 5961013430512MRC Criteria Characteristic ABBH INCLOSURE MATERIAL CERAMIC ABJT TERMINAL LENGTH 0.151 INCHES MINIMUM AND 0.161 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.620 INCHES NOMINAL ABMK OVERALL WIDTH 0.750 INCHES NOMINAL ASKA COMPONENT NAME AND QUANTITY 8 SEMICONDUCTOR DEVICE DIODE AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON ALL SEMICONDUCTOR DEVICE DIODE CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 6.0 MAXIMUM NOMINAL REGULATOR VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 100.0 DEG CELSIUS AMBIENT AIR AFZC FUNCTION FOR WHICH DESIGNED TRANSIENT SUPPRESSOR ABHP OVERALL LENGTH 0.750 INCHES NOMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE FEAT SPECIAL FEATURES ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN TTQY TERMINAL TYPE AND QUANTITY 8 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC |
| ABJT | TERMINAL LENGTH | 0.151 INCHES MINIMUM AND 0.161 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.620 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 0.750 INCHES NOMINAL |
| ASKA | COMPONENT NAME AND QUANTITY | 8 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 6.0 MAXIMUM NOMINAL REGULATOR VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 DEG CELSIUS AMBIENT AIR |
| AFZC | FUNCTION FOR WHICH DESIGNED | TRANSIENT SUPPRESSOR |
| ABHP | OVERALL LENGTH | 0.750 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 8 UNINSULATED WIRE LEAD |
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