156-5726-01 by Tektronix Inc with NSN 5962013761136 - Submit a Quote
| Part No. : 156-5726-01 | Alternate P/N: 156572601 | Manufacturer : Tektronix Inc | NSN : 5962-01-376-1136 |
| Item Name : Microcircuit Digital | CAGE Code : 80009 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 156-5726-01 of NSN 5962013761136 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 156-5726-01 is a microcircuit digital manufactured by tektronix inc under CAGE Code 80009. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 156-5726-01 tektronix inc is in stock.
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NSN Information for Part Number 156-5726-01 with NSN 5962-01-376-1136, 5962013761136
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-376-1136 Item Description: Microcircuit Digital | 5962 | 013761136 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 156-5726-01 | 5 | 1 | C | A |
Characteristics Data of NSN 5962-01-376-1136, 5962013761136MRC Criteria Characteristic ADAQ BODY LENGTH 0.189 INCHES MINIMUM AND 0.197 INCHES MAXIMUM" ADAT BODY WIDTH 0.150 INCHES MINIMUM AND 0.157 INCHES MAXIMUM" ADAU BODY HEIGHT 0.045 INCHES MINIMUM AND 0.065 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 725.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED MONOLITHIC AND HIGH IMPEDANCE AND W/RESET AND ELECTROSTATIC SENSITIVE" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 4 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 1 TIMER" CTQX CURRENT RATING PER CHARACTERISTIC 150.00 MILLIAMPERES REVERSE CURRENT, DC NOMINAL" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 18.0 VOLTS MAXIMUM POWER SOURCE" TTQY TERMINAL TYPE AND QUANTITY 8 GULLWING" ADAQ BODY LENGTH 0.189 INCHES MINIMUM AND 0.197 INCHES MAXIMUM" ADAT BODY WIDTH 0.150 INCHES MINIMUM AND 0.157 INCHES MAXIMUM" ADAU BODY HEIGHT 0.045 INCHES MINIMUM AND 0.065 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 725.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED MONOLITHIC AND HIGH IMPEDANCE AND W/RESET AND ELECTROSTATIC SENSITIVE" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN 4 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 1 TIMER" CTQX CURRENT RATING PER CHARACTERISTIC 150.00 MILLIAMPERES REVERSE CURRENT, DC NOMINAL" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 18.0 VOLTS MAXIMUM POWER SOURCE" TTQY TERMINAL TYPE AND QUANTITY 8 GULLWING"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.189 INCHES MINIMUM AND 0.197 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.150 INCHES MINIMUM AND 0.157 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.065 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 725.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HIGH IMPEDANCE AND W/RESET AND ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 TIMER" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES REVERSE CURRENT, DC NOMINAL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 8 GULLWING" |
| ADAQ | BODY LENGTH | 0.189 INCHES MINIMUM AND 0.197 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.150 INCHES MINIMUM AND 0.157 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.065 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 725.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HIGH IMPEDANCE AND W/RESET AND ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 TIMER" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES REVERSE CURRENT, DC NOMINAL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 8 GULLWING" |
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