MD0289B by Texas Instrument Inc with NSN 5961001889887 - Submit a Quote
Part No. : MD0289B | Manufacturer : Texas Instrument Inc | NSN : 5961-00-188-9887 |
Item Name : Semiconductor Device Diode | CAGE Code : 01295 | FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Aviation Procurement is pleased to announce that part number MD0289B of NSN 5961001889887 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MD0289B is a semiconductor device diode manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MD0289B texas instrument inc is in stock.
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NSN Information for Part Number MD0289B with NSN 5961-00-188-9887, 5961001889887
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-188-9887 Item Description: Semiconductor Device Diode | 5961 | 001889887 | 0 | N | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Md0289b | 2 | 9 | 5 |
Characteristics Data of NSN 5961-00-188-9887, 5961001889887MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.200 INCHES MAXIMUM ABJT TERMINAL LENGTH 0.500 INCHES MINIMUM ADAV OVERALL DIAMETER 0.090 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 0.6 MAXIMUM FORWARD VOLTAGE, AVERAGE CTQX CURRENT RATING PER CHARACTERISTIC 5.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK CTRD POWER RATING PER CHARACTERISTIC 100.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.200 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 0.500 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.090 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 0.6 MAXIMUM FORWARD VOLTAGE, AVERAGE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 5.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK |
CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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