SNG51J by Texas Instrument Inc with NSN 5962007359022 - Submit a Quote
| Part No. : SNG51J | Manufacturer : Texas Instrument Inc | NSN : 5962-00-735-9022 |
| Item Name : Microcircuit Digital | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number SNG51J of NSN 5962007359022 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number SNG51J is a microcircuit digital manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. SNG51J texas instrument inc is in stock.
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NSN Information for Part Number SNG51J with NSN 5962-00-735-9022, 5962007359022
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-735-9022 Item Description: Microcircuit Digital | 5962 | 007359022 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Sng51j | 3 | 1 | 5 |
Characteristics Data of NSN 5962-00-735-9022, 5962007359022MRC Criteria Characteristic ADAQ BODY LENGTH 0.718 INCHES MAXIMUM ADAT BODY WIDTH 0.234 INCHES MAXIMUM ADAU BODY HEIGHT 0.157 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 120.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2-2-2-3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, AND-OR INVERT CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND POSITIVE OUTPUTS CWSG TERMINAL SURFACE TREATMENT SOLDER
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.718 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.234 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.157 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2-2-2-3 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, AND-OR INVERT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND POSITIVE OUTPUTS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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