MPM10938FD by Texas Instrument Inc with NSN 5962013264310 - Submit a Quote
Part No. : MPM10938FD | Manufacturer : Texas Instrument Inc | NSN : 5962-01-326-4310 |
Item Name : Microcircuit Memory | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number MPM10938FD of NSN 5962013264310 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number MPM10938FD is a microcircuit memory manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. MPM10938FD texas instrument inc is in stock.
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NSN Information for Part Number MPM10938FD with NSN 5962-01-326-4310, 5962013264310
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-326-4310 Item Description: Microcircuit Memory | 5962 | 013264310 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mpm10938fd | 2 | 9 | 5 |
Characteristics Data of NSN 5962-01-326-4310, 5962013264310MRC Criteria Characteristic ADAQ BODY LENGTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAT BODY WIDTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.080 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION 1260-01-208-6448 MAST MOUNTED SI CBBL FEATURES PROVIDED BURN IN AND BIPOLAR AND ELECTROSTATIC SENSITIVE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CWSG TERMINAL SURFACE TREATMENT SOLDER TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS CQZP INPUT CIRCUIT PATTERN 6 INPUT CZER MEMORY DEVICE TYPE ROM
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.080 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 1260-01-208-6448 MAST MOUNTED SI |
CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND ELECTROSTATIC SENSITIVE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
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