TIBPAL16R8-30MWB by Texas Instrument Inc with NSN 5962013325751 - Submit a Quote
| Part No. : TIBPAL16R8-30MWB | Alternate P/N: TIBPAL16R830MWB | Manufacturer : Texas Instrument Inc | NSN : 5962-01-332-5751 |
| Item Name : Microcircuit Memory | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number TIBPAL16R8-30MWB of NSN 5962013325751 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number TIBPAL16R8-30MWB is a microcircuit memory manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. TIBPAL16R8-30MWB texas instrument inc is in stock.
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NSN Information for Part Number TIBPAL16R8-30MWB with NSN 5962-01-332-5751, 5962013325751
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-332-5751 Item Description: Microcircuit Memory | 5962 | 013325751 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Tibpal16r8-30mwb | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-332-5751, 5962013325751MRC Criteria Characteristic ABMK OVERALL WIDTH 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM ADAQ BODY LENGTH 0.540 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 0.6 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT AND W/ENABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR CQZP INPUT CIRCUIT PATTERN 16 INPUT CTQX CURRENT RATING PER CHARACTERISTIC 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE PAL TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS CZEQ TIME RATING PER CHACTERISTIC 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-9 MIL-M-38510 ADAU BODY HEIGHT 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 0.6 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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