TMS4256 by Texas Instrument Inc with NSN 5962013705501 - Submit a Quote
| Part No. : TMS4256 | Manufacturer : Texas Instrument Inc | NSN : 5962-01-370-5501 |
| Item Name : Microcircuit Memory | CAGE Code : 01295 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number TMS4256 of NSN 5962013705501 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number TMS4256 is a microcircuit memory manufactured by texas instrument inc under CAGE Code 01295. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. TMS4256 texas instrument inc is in stock.
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NSN Information for Part Number TMS4256 with NSN 5962-01-370-5501, 5962013705501
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-370-5501 Item Description: Microcircuit Memory | 5962 | 013705501 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Tms4256 | 2 | 1 | 5 |
Characteristics Data of NSN 5962-01-370-5501, 5962013705501MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0 TO 110.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION SSRADAR E/I FSCM 56232 CBBL FEATURES PROVIDED DYNAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 11 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510 CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY MICROCIRCUIT,MEMORY-262144 X 1 BIT DYNAMIC RANDOM ACCESS MEMORY (RAM) CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.0 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY CZEP CAPITANCE RATING PER CHARACTERISTIC 8.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM CZES HYBRID TECHNOLOGY TYPE MONOLITHIC ZZZK SPECIFICATION/STANDARD DATA 03640-6135425-1 MANUFACTURERS SPECIFICATION CONTROL AND 03640-6009704 MANUFACTURERS SPECIFICATION CONTROL ZZZX DEPARTURE FROM CITED DESIGNATOR MODIFIED=PACKAGE/LOT SCREENING/BURN-IN CTQX CURRENT RATING PER CHARACTERISTIC 75.00 MILLIAMPERES MAXIMUM APPLIED AND 10.00 MILLIAMPERES MAXIMUM STAND-BY AND -400.00 MILLIAMPERES MAXIMUM OUTPUT ZZZW DEPARTURE FROM CITED DOCUMENT PACKAGE=DIMENSION L1 SHALL BE .165 MIN. CZER MEMORY DEVICE TYPE RAM TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT ADAU BODY HEIGHT 0.200 INCHES MAXIMUM CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MINIMUM READ-WRITE CYCLE AND 150.00 NANOSECONDS MAXIMUM ACCESS TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 110.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | SSRADAR E/I FSCM 56232 |
| CBBL | FEATURES PROVIDED | DYNAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,MEMORY-262144 X 1 BIT DYNAMIC RANDOM ACCESS MEMORY (RAM) |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 8.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM |
| CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| ZZZK | SPECIFICATION/STANDARD DATA | 03640-6135425-1 MANUFACTURERS SPECIFICATION CONTROL AND 03640-6009704 MANUFACTURERS SPECIFICATION CONTROL |
| ZZZX | DEPARTURE FROM CITED DESIGNATOR | MODIFIED=PACKAGE/LOT SCREENING/BURN-IN |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 75.00 MILLIAMPERES MAXIMUM APPLIED AND 10.00 MILLIAMPERES MAXIMUM STAND-BY AND -400.00 MILLIAMPERES MAXIMUM OUTPUT |
| ZZZW | DEPARTURE FROM CITED DOCUMENT | PACKAGE=DIMENSION L1 SHALL BE .165 MIN. |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| ADAU | BODY HEIGHT | 0.200 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MINIMUM READ-WRITE CYCLE AND 150.00 NANOSECONDS MAXIMUM ACCESS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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