HE1285A0D007 by Texas Instrument Inc with NSN 5962013752539 - Submit a Quote
Part No. : HE1285A0D007 | Manufacturer : Texas Instrument Inc | NSN : 5962-01-375-2539 |
Item Name : Microcircuit Memory | CAGE Code : 65425 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number HE1285A0D007 of NSN 5962013752539 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number HE1285A0D007 is a microcircuit memory manufactured by texas instrument inc under CAGE Code 65425. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. HE1285A0D007 texas instrument inc is in stock.
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NSN Information for Part Number HE1285A0D007 with NSN 5962-01-375-2539, 5962013752539
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-375-2539 Item Description: Microcircuit Memory | 5962 | 013752539 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
He1285a0d007 | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-375-2539, 5962013752539MRC Criteria Characteristic CZEP Capitance Rating Per Characteristic 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM CTQX Current Rating Per Characteristic 120.00 MILLIAMPERES MAXIMUM SUPPLY CBBL Features Provided 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). AFJQ Storage Temp Range -65.0 TO 150.0 DEG CELSIUS CQZP Input Circuit Pattern 14 INPUT ADAT Body Width 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM CQSJ Inclosure Material CERAMIC CWSG Terminal Surface Treatment SOLDER ADAQ Body Length 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM AEHX Maximum Power Dissipation Rating 660.0 MILLIWATTS ADAU Body Height 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM TTQY Terminal Type And Quantity 24 PRINTED CIRCUIT CQSZ Inclosure Configuration DUAL-IN-LINE AFGA Operating Temp Range -55.0 TO 125.0 DEG CELSIUS MRC Decoded Requirement Clear Text Reply CZEQ Time Rating Per Chacteristic 45.00 NANOSECONDS MAXIMUM ACCESS CZER Memory Device Type EPROM CQWX Output Logic Form COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
MRC | Criteria | Characteristic |
---|---|---|
CZEP | Capitance Rating Per Characteristic | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM |
CTQX | Current Rating Per Characteristic | 120.00 MILLIAMPERES MAXIMUM SUPPLY |
CBBL | Features Provided | 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 14 INPUT |
ADAT | Body Width | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CQSJ | Inclosure Material | CERAMIC |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 660.0 MILLIWATTS |
ADAU | Body Height | 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
MRC | Decoded Requirement | Clear Text Reply |
CZEQ | Time Rating Per Chacteristic | 45.00 NANOSECONDS MAXIMUM ACCESS |
CZER | Memory Device Type | EPROM |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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