99167819 by Thales Avionics with NSN 5962013106280 - Submit a Quote
| Part No. : 99167819 | Manufacturer : Thales Avionics | NSN : 5962-01-310-6280 |
| Item Name : Microcircuit Memory | CAGE Code : F6481 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number 99167819 of NSN 5962013106280 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number 99167819 is a microcircuit memory manufactured by thales avionics under CAGE Code F6481. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. 99167819 thales avionics is in stock.
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NSN Information for Part Number 99167819 with NSN 5962-01-310-6280, 5962013106280
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-310-6280 Item Description: Microcircuit Memory | 5962 | 013106280 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 99167819 | 5 | 9 | 5 |
Characteristics Data of NSN 5962-01-310-6280, 5962013106280MRC Criteria Characteristic ADAQ BODY LENGTH 2.430 INCHES MAXIMUM ADAT BODY WIDTH 0.610 INCHES MAXIMUM ADAU BODY HEIGHT 0.170 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION AND W/ENABLE AND HIGH PERFORMANCE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 44 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 100.00 NANOSECONDS MAXIMUM DELAY CZER MEMORY DEVICE TYPE PROM TTQY TERMINAL TYPE AND QUANTITY 48 PRINTED CIRCUIT CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 2.430 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.170 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION AND W/ENABLE AND HIGH PERFORMANCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 44 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM DELAY |
| CZER | MEMORY DEVICE TYPE | PROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 48 PRINTED CIRCUIT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
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