XC3030-70PC84C by Xilinx Inc with NSN 5962013782415 - Submit a Quote
| Part No. : XC3030-70PC84C | Alternate P/N: XC303070PC84C | Manufacturer : Xilinx Inc | NSN : 5962-01-378-2415 |
| Item Name : Microcircuit Memory | CAGE Code : 68994 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number XC3030-70PC84C of NSN 5962013782415 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number XC3030-70PC84C is a microcircuit memory manufactured by xilinx inc under CAGE Code 68994. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. XC3030-70PC84C xilinx inc is in stock.
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NSN Information for Part Number XC3030-70PC84C with NSN 5962-01-378-2415, 5962013782415
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-378-2415 Item Description: Microcircuit Memory | 5962 | 013782415 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Xc3030-70pc84c | 2 | 2 | 5 |
Characteristics Data of NSN 5962-01-378-2415, 5962013782415MRC Criteria Characteristic ADAQ BODY LENGTH 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" ADAT BODY WIDTH 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" ADAU BODY HEIGHT 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -20.0/+125.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND PROGRAMMED" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION PIN GRID ARRAY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZER MEMORY DEVICE TYPE PAL" ADAQ BODY LENGTH 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" ADAT BODY WIDTH 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" ADAU BODY HEIGHT 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -20.0/+125.0 DEG CELSIUS" CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND PROGRAMMED" CQSJ INCLOSURE MATERIAL PLASTIC" CQSZ INCLOSURE CONFIGURATION PIN GRID ARRAY" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZER MEMORY DEVICE TYPE PAL"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -20.0/+125.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND PROGRAMMED" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | PIN GRID ARRAY" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| ADAQ | BODY LENGTH | 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -20.0/+125.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND PROGRAMMED" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | PIN GRID ARRAY" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZER | MEMORY DEVICE TYPE | PAL" |
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