XC3090-70PG175B by Xilinx Inc with NSN 5962013806218 - Submit a Quote
| Part No. : XC3090-70PG175B | Alternate P/N: XC309070PG175B | Manufacturer : Xilinx Inc | NSN : 5962-01-380-6218 |
| Item Name : Microcircuit Memory | CAGE Code : 68994 | FSC : 5962 Microcircuits Electronic |
ASAP Aviation Procurement is pleased to announce that part number XC3090-70PG175B of NSN 5962013806218 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number XC3090-70PG175B is a microcircuit memory manufactured by xilinx inc under CAGE Code 68994. Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote.In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
We will be using your response to these fields to calculate your quote. Within 15 minutes of receiving your RFQ, a member of our sales team will contact you with your quote. ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is a leading distributor of new and obsolete NSN parts for the aerospace, civil aviation, and defense industries. With our inventory of more than 2 billion parts sourced from over 5000 manufacturers from around the world, we do our level best to become your go-to one-stop shop. And to help us offer you the best streamlined parts procurement experience, we have advanced shipping facilities across USA. XC3090-70PG175B xilinx inc is in stock.
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NSN Information for Part Number XC3090-70PG175B with NSN 5962-01-380-6218, 5962013806218
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-380-6218 Item Description: Microcircuit Memory | 5962 | 013806218 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Xc3090-70pg175b | 1 | 1 | 5 |
Characteristics Data of NSN 5962-01-380-6218, 5962013806218MRC Criteria Characteristic CZER Memory Device Type PAL TEST Test Data Document 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CQSJ Inclosure Material CERAMIC CBBL Features Provided BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE PMLC Precious Material And Location TERMINALS GOLD CQZP Input Circuit Pattern 64 INPUT AND 10 INPUT CWSG Terminal Surface Treatment GOLD CQSZ Inclosure Configuration LEADED CHIP CARRIER AFJQ Storage Temp Range -65.0/+150.0 DEG CELSIUS PRMT Precious Material GOLD AFGA Operating Temp Range -55.0/+125.0 DEG CELSIUS TTQY Terminal Type And Quantity 175 FLAT LEADS CQWX Output Logic Form COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CZEN Voltage Rating And Type Per Characteristic -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE MRC Decoded Requirement Clear Text Reply
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | Memory Device Type | PAL |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSJ | Inclosure Material | CERAMIC |
| CBBL | Features Provided | BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE |
| PMLC | Precious Material And Location | TERMINALS GOLD |
| CQZP | Input Circuit Pattern | 64 INPUT AND 10 INPUT |
| CWSG | Terminal Surface Treatment | GOLD |
| CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| PRMT | Precious Material | GOLD |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| TTQY | Terminal Type And Quantity | 175 FLAT LEADS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| MRC | Decoded Requirement | Clear Text Reply |
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