C8278 by Semiconductor Components Industr with NSN 5962007386940 - Submit a Quote
Microcircuit Memory
Microcircuit Memory ASAP can help source this line with documentation review, alternate part checks, condition requirements, and account manager follow-up for urgent or planned procurement.
ASAP Aviation Procurement is pleased to announce that part number C8278 of NSN 5962007386940 is now available and in stock. We can get you one of the fastest and most competitive quotes on this part. Part number C8278 is a Microcircuit Memory manufactured by Semiconductor Components Industr under CAGE Code . Simply fill out the Request for Quote (RFQ) form provided here to get started on your quote. In order to make sure that we get you your quote in a timely manner, please take the time to make sure that all fields are completely filled out, particularly the asterisk-marked (*) fields like Parts Needed By and Quantity (ea).
Technical sourcing notes
Operations-grade aviation sourcing.
Request a quote for C8278
Send this part to ASAP with quantity, need-by timing, and buyer contact details. An account manager will review availability, alternates, certificates, and delivery options.
Submit RFQ for C8278
Send this part to ASAP with quantity, need-by timing, and buyer contact details. A dedicated account manager reviews availability, alternates, certificates, and delivery options.
- Manufacturer
- Semiconductor Components Industr
- CAGE
- 31471
NSN Information for Part Number C8278 with NSN 5962-00-738-6940, 5962007386940
Characteristics Data of NSN 5962-00-738-6940, 5962007386940
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.770 INCHES MINIMUM AND 0.790 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.375 INCHES MINIMUM AND 0.385 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.052 INCHES MINIMUM AND 0.062 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
| TEST | TEST DATA DOCUMENT | 06840-6088465 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |