ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 1N5224B, 1N5224, 44-033314-01, RELEASE5566, 3-10194 under NSN 5961-00-194-9127 of Semiconductor Device Diode manufactured by Infineon Technologies, Freescale Semiconductor Inc, On Semiconductor Corporation, Microsemi Corporation, International Diode Corp.
Federal Supply Class of NSN 5961-00-194-9127 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
| Item Name | Semiconductor Device Diode |
| INC Code | 20589 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 00-194-9127 (001949127) |
| NCB Code | USA (00) |
| Manufacturer | Infineon Technologies, Freescale Semiconductor Inc, On Semiconductor Corporation, Microsemi Corporation, International Diode Corp, Burns Aerospace Corp, Motorola Inc, Semitronics Corp, Central Semiconductor Corp, Northrop Grumman Systems Corporation, Thomson Csf Components Corp, C O D I Corp, Electronic Industries Inc, Telcom Semiconductor Inc, General Semiconductor Inc, California Instruments Corp, Fairchild Semiconductor Corp |
| Associated Parts Numbers of NSN 5961-00-194-9127 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 1N5224B | infineon technologies | semiconductor device diode | 81483 | A | A | RFQ |
| 1N5224 | freescale semiconductor inc | semiconductor device diode | 04713 | A | A | RFQ |
| 1N5224B | on semiconductor corporation | semiconductor device diode | 5v1p1 | A | A | RFQ |
| 1N5224B | microsemi corporation | semiconductor device diode | 43611 | A | A | RFQ |
| 1N5224B | international diode corp | semiconductor device diode | 16068 | A | A | RFQ |
| 1N5224B | burns aerospace corp | semiconductor device diode | 27622 | A | A | RFQ |
| 1N5224 | motorola inc | semiconductor device diode | 16333 | A | H | RFQ |
| 1N5224B | semitronics corp | semiconductor device diode | 31338 | A | A | RFQ |
| 1N5224B | central semiconductor corp | semiconductor device diode | 55464 | A | A | RFQ |
| 44-033314-01 | northrop grumman systems corporation | semiconductor device diode | 15280 | A | R | RFQ |
| 1N5224B | thomson csf components corp | semiconductor device diode | 53673 | A | F | RFQ |
| 1N5224B | c o d i corp | semiconductor device diode | 16352 | A | F | RFQ |
| 1N5224B | motorola inc | semiconductor device diode | 16333 | A | H | RFQ |
| 1N5224B | electronic industries inc | semiconductor device diode | 80131 | NSN | Avl | RFQ |
| 1N5224B | freescale semiconductor inc | semiconductor device diode | 04713 | A | A | RFQ |
| 1N5224B | telcom semiconductor inc | semiconductor device diode | 15818 | A | F | RFQ |
| RELEASE5566 | electronic industries inc | semiconductor device diode | 80131 | NSN | Avl | RFQ |
| 1N5224B | general semiconductor inc | semiconductor device diode | 24444 | A | F | RFQ |
| 3-10194 | california instruments corp | semiconductor device diode | 16067 | A | R | RFQ |
| 1N5224B | fairchild semiconductor corp | semiconductor device diode | 07263 | A | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.160 INCHES NOMINAL |
| ABJT | TERMINAL LENGTH | 1.250 INCHES NOMINAL |
| ADAV | OVERALL DIAMETER | 0.075 INCHES NOMINAL |
| AFZC | FUNCTION FOR WHICH DESIGNED | VOLTAGE REFERENCE |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-204AH |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 2.8 NOMINAL NOMINAL REGULATOR VOLTAGE |
| CTQS | VOLTAGE TOLERANCE IN PERCENT | -5.0 TO 5.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 20.00 MILLIAMPERES NOMINAL VOLTAGE REGULATOR DIODE CURRENT |
| CTRD | POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ZZZK | SPECIFICATION/STANDARD DATA | 80131-RELEASE5566 GOVERNMENT SPECIFICATION |
| Relevant Components for NSN - 5961-00-194-9127, 5961001949127 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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