ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 1N918, RELEASE2628 under NSN 5961-00-830-4895 of Semiconductor Device Diode manufactured by General Dynamics Mission Systems, Electronic Industries Inc, Semi General Inc, Joint Electron Device Engineering, Micrometrics Inc.
Federal Supply Class of NSN 5961-00-830-4895 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
| Item Name | Semiconductor Device Diode |
| INC Code | 20589 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 00-830-4895 (008304895) |
| NCB Code | USA (00) |
| Manufacturer | General Dynamics Mission Systems, Electronic Industries Inc, Semi General Inc, Joint Electron Device Engineering, Micrometrics Inc |
| Associated Parts Numbers of NSN 5961-00-830-4895 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 1N918 | general dynamics mission systems | semiconductor device diode | 04655 | F | A | RFQ |
| 1N918 | electronic industries inc | semiconductor device diode | 80131 | NSN | Avl | RFQ |
| RELEASE2628 | electronic industries inc | semiconductor device diode | 80131 | NSN | Avl | RFQ |
| 1N918 | semi general inc | semiconductor device diode | 3bby6 | F | A | RFQ |
| 1N918 | joint electron device engineering | semiconductor device diode | 07688 | NSN | Avl | RFQ |
| 1N918 | micrometrics inc | semiconductor device diode | 0eff4 | A | R | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.105 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTRD | POWER RATING PER CHARACTERISTIC | 1.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| Relevant Components for NSN - 5961-00-830-4895, 5961008304895 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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