ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TM5623MDE 883C, DM7574J 883C, 247ASC2520-016, HPR0M-1-1024-8, S82S129F 883C under NSN 5962-01-068-3316 of Microcircuit Memory manufactured by Intersil Corporation, National Semiconductor Corp, Harris Technical Services Corp, Harris Corporation, Philips Semiconductors Inc.
Federal Supply Class of NSN 5962-01-068-3316 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-068-3316 (010683316) |
NCB Code | USA (01) |
Manufacturer | Intersil Corporation, National Semiconductor Corp, Harris Technical Services Corp, Harris Corporation, Philips Semiconductors Inc |
Associated Parts Numbers of NSN 5962-01-068-3316 | ||||||
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Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
TM5623MDE 883C | intersil corporation | microcircuit memory | 32293 | A | F | RFQ |
DM7574J 883C | national semiconductor corp | microcircuit memory | 27014 | A | A | RFQ |
247ASC2520-016 | harris technical services corp | microcircuit memory | 0c9d4 | F | A | RFQ |
HPR0M-1-1024-8 | harris corporation | microcircuit memory | 91417 | A | A | RFQ |
S82S129F 883C | philips semiconductors inc | microcircuit memory | 18324 | A | F | RFQ |
HPR0M-1-1024-8 | intersil corporation | microcircuit memory | 34371 | A | A | RFQ |
MRC | Criteria | Characteristic |
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ADAQ | BODY LENGTH | 0.815 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
Relevant Components for NSN - 5962-01-068-3316, 5962010683316 | ||||
5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2813 (5905000012813) | 5905-00-001-2834 (5905000012834) | |
5905-00-001-2852 (5905000012852) | 5905-00-001-2882 (5905000012882) | 5905-00-001-2890 (5905000012890) | 5905-00-001-2920 (5905000012920) | |
5905-00-001-2934 (5905000012934) | 5905-00-001-2951 (5905000012951) | 5905-00-001-2952 (5905000012952) | 5905-00-001-2954 (5905000012954) | |
AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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