ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers JM38510 23805BVA, 1041689-1, AM2147-55 BVA, 899582-1, D2147H-3 under NSN 5962-01-152-1822 of Microcircuit Memory manufactured by Pioneer Standard Electronics Inc, Raytheon Aircraft, Advanced Micro Devices Inc, Intel Corp Sales Office, Hitachi Kokusai Electric America Ltd.
Federal Supply Class of NSN 5962-01-152-1822 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-152-1822 (011521822) |
| NCB Code | USA (01) |
| Manufacturer | Pioneer Standard Electronics Inc, Raytheon Aircraft, Advanced Micro Devices Inc, Intel Corp Sales Office, Hitachi Kokusai Electric America Ltd |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| JM38510 23805BVA | pioneer standard electronics inc | microcircuit memory | RFQ |
| 1041689-1 | raytheon aircraft | microcircuit memory | RFQ |
| AM2147-55 BVA | advanced micro devices inc | microcircuit memory | RFQ |
| 899582-1 | raytheon aircraft | microcircuit memory | RFQ |
| D2147H-3 | intel corp sales office | microcircuit memory | RFQ |
| MD2147A | intel corp sales office | microcircuit memory | RFQ |
| HM6147P3 | hitachi kokusai electric america ltd | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.960 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-6 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/238 GOVERNMENT SPECIFICATION |
| Relevant Components for NSN - 5962-01-152-1822, 5962011521822 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2813 (5905000012813) | 5905-00-001-2834 (5905000012834) | |
| 5905-00-001-2852 (5905000012852) | 5905-00-001-2882 (5905000012882) | 5905-00-001-2890 (5905000012890) | 5905-00-001-2920 (5905000012920) | |
| 5905-00-001-2934 (5905000012934) | 5905-00-001-2951 (5905000012951) | 5905-00-001-2952 (5905000012952) | 5905-00-001-2954 (5905000012954) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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