ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 144A9552P6, ROM PROM FAMILY 051, S8337, CC4497, 299A9982P462 under NSN 5962-01-186-5724 of Microcircuit Memory manufactured by Bae Systems, Dla Land And Maritime, Intel Corp Sales Office, Philips Semiconductors Inc, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-186-5724 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-186-5724 (011865724) |
NCB Code | USA (01) |
Manufacturer | Bae Systems, Dla Land And Maritime, Intel Corp Sales Office, Philips Semiconductors Inc, Advanced Micro Devices Inc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
144A9552P6 | bae systems | microcircuit memory | RFQ |
ROM PROM FAMILY 051 | dla land and maritime | microcircuit memory | RFQ |
S8337 | intel corp sales office | microcircuit memory | RFQ |
CC4497 | philips semiconductors inc | microcircuit memory | RFQ |
299A9982P462 | bae systems | microcircuit memory | RFQ |
7138DPAH | advanced micro devices inc | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
Relevant Components for NSN - 5962-01-186-5724, 5962011865724 | ||||
5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2813 (5905000012813) | 5905-00-001-2834 (5905000012834) | |
5905-00-001-2852 (5905000012852) | 5905-00-001-2882 (5905000012882) | 5905-00-001-2890 (5905000012890) | 5905-00-001-2920 (5905000012920) | |
5905-00-001-2934 (5905000012934) | 5905-00-001-2951 (5905000012951) | 5905-00-001-2952 (5905000012952) | 5905-00-001-2954 (5905000012954) | |
AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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