ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers S82S185I 883B, ROM PROM FAMILY 007, 5E8071 253C1400, M38510/20902BVB, 5E8071 253 APP 1400 under NSN 5962-01-221-2781 of Microcircuit Memory manufactured by Philips Semiconductors Ltd, Dla Land And Maritime, Hamilton Sundstrand Corporation, Military Specifications.
Federal Supply Class of NSN 5962-01-221-2781 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-221-2781 (012212781) |
| NCB Code | USA (01) |
| Manufacturer | Philips Semiconductors Ltd, Dla Land And Maritime, Hamilton Sundstrand Corporation, Military Specifications |
| Associated Parts Numbers of NSN 5962-01-221-2781 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| S82S185I 883B | philips semiconductors ltd | microcircuit memory | 18324 | A | F | RFQ |
| ROM PROM FAMILY 007 | dla land and maritime | microcircuit memory | 16236 | A | A | RFQ |
| 5E8071 253C1400 | hamilton sundstrand corporation | microcircuit memory | 73030 | A | A | RFQ |
| M38510/20902BVB | military specifications | microcircuit memory | 81349 | NSN | Avl | RFQ |
| 5E8071 253 APP 1400 | hamilton sundstrand corporation | microcircuit memory | 73030 | A | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.890 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND SCHOTTKY AND W/ENABLE AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-221-2781, 5962012212781 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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