ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 81036, ROM PROM HEAD 254, PAL16R4AML 883B, AMPAL16R4A B2A, PAL16R4AMFKB under NSN 5962-01-264-3009 of Microcircuit Memory manufactured by Dla Land And Maritime, Mmi Amd, Advanced Micro Devices Inc, Texas Instruments Inc, Raytheon Company.
Federal Supply Class of NSN 5962-01-264-3009 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-264-3009 (012643009) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Mmi Amd, Advanced Micro Devices Inc, Texas Instruments Inc, Raytheon Company, Nimikkeistokeskus Ncb Finland |
| Associated Parts Numbers of NSN 5962-01-264-3009 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 81036 | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| ROM PROM HEAD 254 | dla land and maritime | microcircuit memory | 16236 | A | A | RFQ |
| PAL16R4AML 883B | mmi amd | microcircuit memory | 50364 | A | F | RFQ |
| AMPAL16R4A B2A | advanced micro devices inc | microcircuit memory | 34335 | A | A | RFQ |
| PAL16R4AMFKB | texas instruments inc | microcircuit memory | 01295 | A | A | RFQ |
| 81036102X | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| G279788-852 | raytheon company | microcircuit memory | 3b150 | A | A | RFQ |
| 81036102B | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 10133855 | nimikkeistokeskus ncb finland | microcircuit memory | a486g | H | A | RFQ |
| 81036102A | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| Relevant Components for NSN - 5962-01-264-3009, 5962012643009 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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