NSN 5962-01-264-5236 of Microcircuit Memory - Parts Details

ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 7909887-45, ROM PROM HEAD 209, PAL16L8AML 883B, 81036072X, PAL16L8AMFKB under NSN 5962-01-264-5236 of Microcircuit Memory manufactured by Lockheed Martin Corporation, Dla Land And Maritime, Mmi Amd, Texas Instruments Inc, Advanced Micro Devices Inc.

Federal Supply Class of NSN 5962-01-264-5236 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.

Item Name Microcircuit Memory
INC Code 41015
Federal Supply Group (FSG) Electrical and Electronic Equipment Components
Federal Supply Class (FSC) 5962 Microcircuits Electronic
National Item Identification Number (NIIN) 01-264-5236 (012645236)
NCB Code USA (01)
Manufacturer Lockheed Martin Corporation, Dla Land And Maritime, Mmi Amd, Texas Instruments Inc, Advanced Micro Devices Inc, Nimikkeistokeskus Ncb Finland
Associated Parts Numbers of NSN 5962-01-264-5236
Part Number Manufacturer Item Name Cage Code Type Status RFQ
7909887-45 lockheed martin corporation microcircuit memory 90536 A A RFQ
ROM PROM HEAD 209 dla land and maritime microcircuit memory 16236 A A RFQ
PAL16L8AML 883B mmi amd microcircuit memory 50364 A F RFQ
81036072X dla land and maritime microcircuit memory 67268 M A RFQ
PAL16L8AMFKB texas instruments inc microcircuit memory 01295 A A RFQ
81036072B dla land and maritime microcircuit memory 67268 M A RFQ
AMPAL16L8A B2A advanced micro devices inc microcircuit memory 34335 A A RFQ
81036072A dla land and maritime microcircuit memory 67268 M A RFQ
10133853 nimikkeistokeskus ncb finland microcircuit memory a486g H A RFQ
81036 dla land and maritime microcircuit memory 67268 M A RFQ

Technical Characteristics of NSN 5962012645236

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.358 INCHES MAXIMUM
ADATBODY WIDTH0.358 INCHES MAXIMUM
ADAUBODY HEIGHT0.100 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING1.0 WATTS
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS
CQSJINCLOSURE MATERIALCERAMIC AND GLASS
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
CQZPINPUT CIRCUIT PATTERN16 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES NOMINAL OUTPUT
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEPAL
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQYTERMINAL TYPE AND QUANTITY20 LEADLESS

Relevant Components for NSN - 5962-01-264-5236, 5962012645236
5905-00-000-0136 (5905000000136) 5905-00-001-2573 (5905000012573) 5905-00-001-2812 (5905000012812) 5905-00-001-2813 (5905000012813)
5905-00-001-2814 (5905000012814) 5905-00-001-2815 (5905000012815) 5905-00-001-2818 (5905000012818) 5905-00-001-2819 (5905000012819)
5905-00-001-2821 (5905000012821) 5905-00-001-2822 (5905000012822) 5905-00-001-2826 (5905000012826) 5905-00-001-2827 (5905000012827)

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