NSN 5962-01-265-4751 of Microcircuit Digital - Parts Details
Alternative NSN: 5962012654751 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012654751 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Raytheon Technical Services Company , Raytheon Aircraft , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54ALS38AFK, G282776-852, G279986-852, 5962-86871012X, 5962-86871012B under NSN 5962-01-265-4751 of Microcircuit Digital manufactured by Texas Instrument Inc, Raytheon Technical Services Company, Raytheon Aircraft, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-265-4751 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-265-4751, 5962012654751
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Part No Manufacturer Item Name QTY RFQ SNJ54ALS38AFK Texas Instrument Inc microcircuit digital Avl RFQ G282776-852 Raytheon Technical Services Company microcircuit digital Avl RFQ G279986-852 Raytheon Aircraft microcircuit digital Avl RFQ 5962-86871012X Dla Land And Maritime microcircuit digital Avl RFQ 5962-86871012B Dla Land And Maritime microcircuit digital Avl RFQ 5962-86871012A Dla Land And Maritime microcircuit digital Avl RFQ 5962-86871 Dla Land And Maritime microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012654751MRC Criteria Characteristic ADAQ BODY LENGTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAT BODY WIDTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 172.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED LOW POWER AND SCHOTTKY AND MONOLITHIC AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 BUFFER, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 7.80 MILLIAMPERES FORWARD CURRENT, NONREPETITIVE, MAXIMUM PEAK TOTAL VALUE ABSOLUTE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 172.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | LOW POWER AND SCHOTTKY AND MONOLITHIC AND HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 BUFFER, NAND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 7.80 MILLIAMPERES FORWARD CURRENT, NONREPETITIVE, MAXIMUM PEAK TOTAL VALUE ABSOLUTE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |