ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 5962-85155112A, TIBPAL16R6-15MFKB, 5962-8515511B2A, 5962-8515511B2X, PAL16R6DML 883B under NSN 5962-01-304-4398 of Microcircuit Memory manufactured by Dla Land And Maritime, Texas Instruments Inc, Mmi Amd.
Federal Supply Class of NSN 5962-01-304-4398 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-304-4398 (013044398) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Texas Instruments Inc, Mmi Amd |
| Associated Parts Numbers of NSN 5962-01-304-4398 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 5962-85155112A | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| TIBPAL16R6-15MFKB | texas instruments inc | microcircuit memory | 01295 | A | A | RFQ |
| 5962-8515511B2A | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-8515511B2X | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| PAL16R6DML 883B | mmi amd | microcircuit memory | 50364 | A | F | RFQ |
| 5962-85155 | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-8515511B2B | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-85155112X | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-85155112B | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES MAXIMUM OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PIN |
| Relevant Components for NSN - 5962-01-304-4398, 5962013044398 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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