ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM HEAD 125, 5962-85155, 5962-8515505B2X, 5962-8515505B2A, 5962-85155052A under NSN 5962-01-305-3125 of Microcircuit Memory manufactured by Dla Land And Maritime, Texas Instrument Inc, Advanced Micro Devices Inc, Mmi Amd.
Federal Supply Class of NSN 5962-01-305-3125 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-305-3125 (013053125) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Texas Instrument Inc, Advanced Micro Devices Inc, Mmi Amd |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| ROM PROM HEAD 125 | dla land and maritime | microcircuit memory | RFQ |
| 5962-85155 | dla land and maritime | microcircuit memory | RFQ |
| 5962-8515505B2X | dla land and maritime | microcircuit memory | RFQ |
| 5962-8515505B2A | dla land and maritime | microcircuit memory | RFQ |
| 5962-85155052A | dla land and maritime | microcircuit memory | RFQ |
| TIBPAL16L8-30MPKB | texas instrument inc | microcircuit memory | RFQ |
| 5962-8515505B2B | dla land and maritime | microcircuit memory | RFQ |
| AMPAL16L8AL B2A | advanced micro devices inc | microcircuit memory | RFQ |
| PAL16L8B 2ML 883B | mmi amd | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.358 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.100 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.358 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.088 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND MONOLITHIC AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PIN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| Relevant Components for NSN - 5962-01-305-3125, 5962013053125 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2813 (5905000012813) | 5905-00-001-2834 (5905000012834) | |
| 5905-00-001-2852 (5905000012852) | 5905-00-001-2882 (5905000012882) | 5905-00-001-2890 (5905000012890) | 5905-00-001-2920 (5905000012920) | |
| 5905-00-001-2934 (5905000012934) | 5905-00-001-2951 (5905000012951) | 5905-00-001-2952 (5905000012952) | 5905-00-001-2954 (5905000012954) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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