ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers F1601DMQB35, 5962-86015, 5962-8601502XB, 5962-8601502XA, 5962-8601502XX under NSN 5962-01-353-8042 of Microcircuit Memory manufactured by National Semiconductor Corp, Dla Land And Maritime, Stmicroelectronics Inc, Freescale Semiconductor Inc.
Federal Supply Class of NSN 5962-01-353-8042 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-353-8042 (013538042) |
| NCB Code | USA (01) |
| Manufacturer | National Semiconductor Corp, Dla Land And Maritime, Stmicroelectronics Inc, Freescale Semiconductor Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| F1601DMQB35 | national semiconductor corp | microcircuit memory | RFQ |
| 5962-86015 | dla land and maritime | microcircuit memory | RFQ |
| 5962-8601502XB | dla land and maritime | microcircuit memory | RFQ |
| 5962-8601502XA | dla land and maritime | microcircuit memory | RFQ |
| 5962-8601502XX | dla land and maritime | microcircuit memory | RFQ |
| MKX41H87P835 | stmicroelectronics inc | microcircuit memory | RFQ |
| 62L87-35 BXAJC | freescale semiconductor inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 8.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM ACCESS |
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| Relevant Components for NSN - 5962-01-353-8042, 5962013538042 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2813 (5905000012813) | 5905-00-001-2834 (5905000012834) | |
| 5905-00-001-2852 (5905000012852) | 5905-00-001-2882 (5905000012882) | 5905-00-001-2890 (5905000012890) | 5905-00-001-2920 (5905000012920) | |
| 5905-00-001-2934 (5905000012934) | 5905-00-001-2951 (5905000012951) | 5905-00-001-2952 (5905000012952) | 5905-00-001-2954 (5905000012954) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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