ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers D28F010-200P1C4, 5962-90899, 5962-9089902MXB, 5962-9089902MXX, 7920457-00 under NSN 5962-01-395-5780 of Microcircuit Memory manufactured by Intel Corporation, Dla Land And Maritime, Lockheed Martin Corporation, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-395-5780 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-395-5780 (013955780) |
| NCB Code | USA (01) |
| Manufacturer | Intel Corporation, Dla Land And Maritime, Lockheed Martin Corporation, Advanced Micro Devices Inc |
| Associated Parts Numbers of NSN 5962-01-395-5780 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| D28F010-200P1C4 | intel corporation | microcircuit memory | 34649 | A | A | RFQ |
| 5962-90899 | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-9089902MXB | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 5962-9089902MXX | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 7920457-00 | lockheed martin corporation | microcircuit memory | 90536 | A | A | RFQ |
| AM28F010 200 BXA | advanced micro devices inc | microcircuit memory | 34335 | A | A | RFQ |
| 5962-9089902MXA | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| MD28F010-20 B | intel corporation | microcircuit memory | 34649 | A | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS |
| CZER | MEMORY DEVICE TYPE | PROM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 128K X 8 CMOS EEPROM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-395-5780, 5962013955780 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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