NSN 5961-00-089-0499 of Transistor - Parts Details
| Alternative NSN: 5961000890499 |
| Item Name: Transistor |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 000890499 |
| NCB Code: USA (00) |
| Manufacturers: Ericsson Inc , Eads Deutschland Gmbh Verteidig , Electronic Industries Association , Texas Instrument Inc , Ampex Data Systems Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers KS80455B2N2218, 8050023, 80500023, 5L5512-201-08, 2N2218 under NSN 5961-00-089-0499 of Transistor manufactured by Ericsson Inc, Eads Deutschland Gmbh Verteidig, Electronic Industries Association, Texas Instrument Inc, Ampex Data Systems Corporation.
Federal Supply Class of NSN 5961-00-089-0499 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-089-0499, 5961000890499
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Part No Manufacturer Item Name QTY RFQ KS80455B2N2218 Ericsson Inc transistor Avl RFQ 8050023 Ericsson Inc transistor Avl RFQ 80500023 Ericsson Inc transistor Avl RFQ 5L5512-201-08 Eads Deutschland Gmbh Verteidig transistor Avl RFQ 2N2218 Electronic Industries Association transistor Avl RFQ 2N2218 Texas Instrument Inc transistor Avl RFQ 2N1387 Electronic Industries Association transistor Avl RFQ 2L5512-230-007425 Eads Deutschland Gmbh Verteidig transistor Avl RFQ 014-210 Ampex Data Systems Corporation transistor Avl RFQ
Characteristics Data of NSN 5961000890499MRC Criteria Characteristic ALAS INTERNAL CONFIGURATION JUNCTION CONTACT CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ III SEMICONDUCTOR MATERIAL SILICON FEAT SPECIAL FEATURES JUNCTION PATTERN ARRANGEMENT: NPN TTQY TERMINAL TYPE AND QUANTITY 3 UNINSULATED WIRE LEAD ZZZK SPECIFICATION/STANDARD DATA 80131-2N2218 PROFESSIONAL/INDUSTRIAL ASSOCIATION STANDARD
| MRC | Criteria | Characteristic |
|---|---|---|
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| ZZZK | SPECIFICATION/STANDARD DATA | 80131-2N2218 PROFESSIONAL/INDUSTRIAL ASSOCIATION STANDARD |