NSN 5961-00-450-6362 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961004506362 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 004506362 |
| NCB Code: USA (00) |
| Manufacturers: Electronic Industries Association , C O D I Corp , Eastron Corp , Freescale Semiconductor Inc , Crystalonics Inc , Silicon Graphics Inc , Trw Electronic Components Division , Msi Electronics Inc , Telcom Semiconductor Inc , Api Electronics Inc , Avago Technologies Us Inc Division , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers RELEASE5259, 1N5145, 0122-0257 under NSN 5961-00-450-6362 of Semiconductor Device Diode manufactured by Electronic Industries Association, C O D I Corp, Eastron Corp, Freescale Semiconductor Inc, Crystalonics Inc.
Federal Supply Class of NSN 5961-00-450-6362 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-450-6362, 5961004506362
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Part No Manufacturer Item Name QTY RFQ RELEASE5259 Electronic Industries Association semiconductor device diode Avl RFQ 1N5145 C O D I Corp semiconductor device diode Avl RFQ 1N5145 Eastron Corp semiconductor device diode Avl RFQ 1N5145 Freescale Semiconductor Inc semiconductor device diode Avl RFQ 1N5145 Crystalonics Inc semiconductor device diode Avl RFQ 1N5145 Silicon Graphics Inc semiconductor device diode Avl RFQ 1N5145 Trw Electronic Components Division semiconductor device diode Avl RFQ 1N5145 Electronic Industries Association semiconductor device diode Avl RFQ 1N5145 Msi Electronics Inc semiconductor device diode Avl RFQ 1N5145 Telcom Semiconductor Inc semiconductor device diode Avl RFQ 1N5145 Api Electronics Inc semiconductor device diode Avl RFQ 0122-0257 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ 0122-0257 Hewlett Packard Co semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961004506362MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION DO-7 AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 60.0 MAXIMUM REVERSE VOLTAGE, PEAK CTRD POWER RATING PER CHARACTERISTIC 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD ZZZK SPECIFICATION/STANDARD DATA 80131-RELEASE5259 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ZZZK | SPECIFICATION/STANDARD DATA | 80131-RELEASE5259 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |