NSN 5961-00-677-9059 of Semiconductor Device Set - Parts Details
| Alternative NSN: 5961006779059 |
| Item Name: Semiconductor Device Set |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 006779059 |
| NCB Code: USA (00) |
| Manufacturers: Gilbert Engineering Co Inc Incon , Navair Ltd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SV6033, 1847301 under NSN 5961-00-677-9059 of Semiconductor Device Set manufactured by Gilbert Engineering Co Inc Incon, Navair Ltd.
Federal Supply Class of NSN 5961-00-677-9059 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-677-9059, 5961006779059
Characteristics Data of NSN 5961006779059MRC Criteria Characteristic ABBH INCLOSURE MATERIAL METAL ALL SEMICONDUCTOR DEVICE DIODE AKPV MOUNTING FACILITY QUANTITY 1 ALL SEMICONDUCTOR DEVICE DIODE ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED ASKA COMPONENT NAME AND QUANTITY 2 SEMICONDUCTOR DEVICE DIODE AXGY MOUNTING METHOD THREADED STUD ALL SEMICONDUCTOR DEVICE DIODE CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE AND MOUNTING HARDWARE CCDG OVERALL WIDTH ACROSS FLATS 0.438 INCHES NOMINAL ALL SEMICONDUCTOR DEVICE DIODE CQJX NOMINAL THREAD SIZE 0.190 INCHES ALL SEMICONDUCTOR DEVICE DIODE CTMZ SEMICONDUCTOR MATERIAL SILICON ALL SEMICONDUCTOR DEVICE DIODE CTQX CURRENT RATING PER CHARACTERISTIC 100.00 MILLIAMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE THSD THREAD SERIES DESIGNATOR UNF ALL SEMICONDUCTOR DEVICE DIODE TTQY TERMINAL TYPE AND QUANTITY 1 TAB, SOLDER LUG ALL SEMICONDUCTOR DEVICE DIODE AND 1 THREADED STUD ALL SEMICONDUCTOR DEVICE DIODE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL ALL SEMICONDUCTOR DEVICE DIODE |
| AKPV | MOUNTING FACILITY QUANTITY | 1 ALL SEMICONDUCTOR DEVICE DIODE |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | THREADED STUD ALL SEMICONDUCTOR DEVICE DIODE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE AND MOUNTING HARDWARE |
| CCDG | OVERALL WIDTH ACROSS FLATS | 0.438 INCHES NOMINAL ALL SEMICONDUCTOR DEVICE DIODE |
| CQJX | NOMINAL THREAD SIZE | 0.190 INCHES ALL SEMICONDUCTOR DEVICE DIODE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE |
| THSD | THREAD SERIES DESIGNATOR | UNF ALL SEMICONDUCTOR DEVICE DIODE |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG ALL SEMICONDUCTOR DEVICE DIODE AND 1 THREADED STUD ALL SEMICONDUCTOR DEVICE DIODE |