NSN 5961-01-063-3213 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961010633213 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 010633213 |
| NCB Code: USA (01) |
| Manufacturers: Harris Corporation , Concurrent Computer Corporation , Electronic Industries Association , Freescale Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers D22-0007-006, D22-0007-004, 57110-0066-00, 1N4937 under NSN 5961-01-063-3213 of Semiconductor Device Diode manufactured by Harris Corporation, Concurrent Computer Corporation, Electronic Industries Association, Freescale Semiconductor Inc.
Federal Supply Class of NSN 5961-01-063-3213 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-063-3213, 5961010633213
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Part No Manufacturer Item Name QTY RFQ D22-0007-006 Harris Corporation semiconductor device diode Avl RFQ D22-0007-004 Harris Corporation semiconductor device diode Avl RFQ 57110-0066-00 Concurrent Computer Corporation semiconductor device diode Avl RFQ 1N4937 Electronic Industries Association semiconductor device diode Avl RFQ 1N4937 Freescale Semiconductor Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961010633213MRC Criteria Characteristic ABHP OVERALL LENGTH 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.100 INCHES MINIMUM ADAV OVERALL DIAMETER 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL AYQS TERMINAL CIRCLE DIAMETER 0.030 INCHES MINIMUM AND 0.034 INCHES MAXIMUM CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQX CURRENT RATING PER CHARACTERISTIC 50.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION FEAT SPECIAL FEATURES 150 NSEC RECOVERY TIME; JUNCTION PATTERN ARRANGEMENT: PN TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.100 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| AYQS | TERMINAL CIRCLE DIAMETER | 0.030 INCHES MINIMUM AND 0.034 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| FEAT | SPECIAL FEATURES | 150 NSEC RECOVERY TIME; JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |