NSN 5961-01-398-9096 of Transistor - Parts Details
| Alternative NSN: 5961013989096 |
| Item Name: Transistor |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013989096 |
| NCB Code: USA (01) |
| Manufacturers: Siliconix Incorporated Div Silic , International Rectifier Corporation , Semiconductor Technology Inc , Thales Avionics |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SIHFP450, IRFP450, 3018652 under NSN 5961-01-398-9096 of Transistor manufactured by Siliconix Incorporated Div Silic, International Rectifier Corporation, Semiconductor Technology Inc, Thales Avionics.
Federal Supply Class of NSN 5961-01-398-9096 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-398-9096, 5961013989096
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Part No Manufacturer Item Name QTY RFQ SIHFP450 Siliconix Incorporated Div Silic transistor Avl RFQ IRFP450 International Rectifier Corporation transistor Avl RFQ IRFP450 Siliconix Incorporated Div Silic transistor Avl RFQ IRFP450 Semiconductor Technology Inc transistor Avl RFQ 3018652 Thales Avionics transistor Avl RFQ
Characteristics Data of NSN 5961013989096MRC Criteria Characteristic ABMK OVERALL WIDTH 15.9 MILLIMETERS MAXIMUM AKPV MOUNTING FACILITY QUANTITY 1 TTQY TERMINAL TYPE AND QUANTITY 3 PIN CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 20.0 MAXIMUM GATE TO SOURCE VOLTAGE CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION ABBH INCLOSURE MATERIAL PLASTIC AXGY MOUNTING METHOD UNTHREADED HOLE ALAS INTERNAL CONFIGURATION FIELD EFFECT ABKW OVERALL HEIGHT 5.3 MILLIMETERS MAXIMUM ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION TO-247AC CTRD POWER RATING PER CHARACTERISTIC 190.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION CTMZ SEMICONDUCTOR MATERIAL SILICON ABHP OVERALL LENGTH 35.1 MILLIMETERS MAXIMUM
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 15.9 MILLIMETERS MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MAXIMUM GATE TO SOURCE VOLTAGE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| ALAS | INTERNAL CONFIGURATION | FIELD EFFECT |
| ABKW | OVERALL HEIGHT | 5.3 MILLIMETERS MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-247AC |
| CTRD | POWER RATING PER CHARACTERISTIC | 190.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| ABHP | OVERALL LENGTH | 35.1 MILLIMETERS MAXIMUM |