NSN 5962-00-007-0976 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962000070976 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 000070976 |
| NCB Code: USA (00) |
| Manufacturers: Fairchild Semiconductor Corp , Applied Technology |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers A6H903559X, 93435DC, 9035DM, 44-010392-01 under NSN 5962-00-007-0976 of Microcircuit Memory manufactured by Fairchild Semiconductor Corp, Applied Technology.
Federal Supply Class of NSN 5962-00-007-0976 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-007-0976, 5962000070976
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Part No Manufacturer Item Name QTY RFQ A6H903559X Fairchild Semiconductor Corp microcircuit memory Avl RFQ 93435DC Fairchild Semiconductor Corp microcircuit memory Avl RFQ 9035DM Fairchild Semiconductor Corp microcircuit memory Avl RFQ 44-010392-01 Applied Technology microcircuit memory Avl RFQ
Characteristics Data of NSN 5962000070976MRC Criteria Characteristic ADAQ BODY LENGTH 1.832 INCHES MINIMUM AND 1.868 INCHES MAXIMUM ADAT BODY WIDTH 0.515 INCHES MINIMUM AND 0.525 INCHES MAXIMUM ADAU BODY HEIGHT 0.072 INCHES MINIMUM AND 0.078 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND W/ENABLE AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-LOGIC CQZP INPUT CIRCUIT PATTERN 22 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 36 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.832 INCHES MINIMUM AND 1.868 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.525 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.072 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND W/ENABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 36 PRINTED CIRCUIT |