NSN 5962-00-008-6843 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962000086843 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 000086843 |
| NCB Code: USA (00) |
| Manufacturers: Texas Instrument Inc , Freescale Semiconductor Inc , Adelco Elektronik Gmbh , Lacon Electronic Gmbh , Intersil Corporation , Edo Ail Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TP4010AJ, MC14010CL, MC14010BCLA, HD1-4010-9, CD4010AD under NSN 5962-00-008-6843 of Microcircuit Digital manufactured by Texas Instrument Inc, Freescale Semiconductor Inc, Adelco Elektronik Gmbh, Lacon Electronic Gmbh, Intersil Corporation.
Federal Supply Class of NSN 5962-00-008-6843 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-008-6843, 5962000086843
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Part No Manufacturer Item Name QTY RFQ TP4010AJ Texas Instrument Inc microcircuit digital Avl RFQ MC14010CL Freescale Semiconductor Inc microcircuit digital Avl RFQ MC14010BCLA Adelco Elektronik Gmbh microcircuit digital Avl RFQ MC14010BCLA Lacon Electronic Gmbh microcircuit digital Avl RFQ HD1-4010-9 Intersil Corporation microcircuit digital Avl RFQ CD4010AD Intersil Corporation microcircuit digital Avl RFQ 600595-01 Edo Ail Systems Inc microcircuit digital Avl RFQ 14010CL Freescale Semiconductor Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962000086843MRC Criteria Characteristic ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/BUFFERED OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN HEX 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 BUFFER, NONINVERTING AND 6 CONVERTER, LOGIC LEVEL CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL CZEQ TIME RATING PER CHACTERISTIC 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/BUFFERED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, NONINVERTING AND 6 CONVERTER, LOGIC LEVEL |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |