NSN 5962-00-106-2193 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962001062193 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 001062193 |
| NCB Code: USA (00) |
| Manufacturers: Texas Instrument Inc , Fairchild Semiconductor Corp , National Semiconductor Corp , Xerox Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UA709MJB, UA709MJ 883B-00, UA709AMJ883B, SNC52709J-00, SNC52709J under NSN 5962-00-106-2193 of Microcircuit Linear manufactured by Texas Instrument Inc, Fairchild Semiconductor Corp, National Semiconductor Corp, Xerox Corporation.
Federal Supply Class of NSN 5962-00-106-2193 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-106-2193, 5962001062193
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Part No Manufacturer Item Name QTY RFQ UA709MJB Texas Instrument Inc microcircuit linear Avl RFQ UA709MJ 883B-00 Texas Instrument Inc microcircuit linear Avl RFQ UA709AMJ883B Fairchild Semiconductor Corp microcircuit linear Avl RFQ SNC52709J-00 Texas Instrument Inc microcircuit linear Avl RFQ SNC52709J Texas Instrument Inc microcircuit linear Avl RFQ SN72709 Texas Instrument Inc microcircuit linear Avl RFQ LM709CM National Semiconductor Corp microcircuit linear Avl RFQ 10122 Xerox Corporation microcircuit linear Avl RFQ
Characteristics Data of NSN 5962001062193MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 165.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND EXTERNALLY COMPENSATED AND MONOLITHIC AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 4 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 165.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND EXTERNALLY COMPENSATED AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 4 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |