NSN 5962-00-220-2426 of Microcircuit Digital - Parts Details
Alternative NSN: 5962002202426 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 002202426 |
NCB Code: USA (00) |
Manufacturers: Adelco Elektronik Gmbh , Lacon Electronic Gmbh , Texas Instrument Inc , Freescale Semiconductor Inc , Tadiran Ltd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ5410WA, SNJ5410W, SN5410, MC5410F, 5921030 under NSN 5962-00-220-2426 of Microcircuit Digital manufactured by Adelco Elektronik Gmbh, Lacon Electronic Gmbh, Texas Instrument Inc, Freescale Semiconductor Inc, Tadiran Ltd.
Federal Supply Class of NSN 5962-00-220-2426 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-220-2426, 5962002202426
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Part No Manufacturer Item Name QTY RFQ SNJ5410WA Adelco Elektronik Gmbh microcircuit digital Avl RFQ SNJ5410W Lacon Electronic Gmbh microcircuit digital Avl RFQ SNJ5410W Adelco Elektronik Gmbh microcircuit digital Avl RFQ SNJ5410W Texas Instrument Inc microcircuit digital Avl RFQ SN5410 Texas Instrument Inc microcircuit digital Avl RFQ MC5410F Freescale Semiconductor Inc microcircuit digital Avl RFQ 5921030 Tadiran Ltd microcircuit digital Avl RFQ 5410 BABJC Freescale Semiconductor Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962002202426MRC Criteria Characteristic ADAQ BODY LENGTH 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 120.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM POWER AND MEDIUM SPEED AND W/TOTEM POLE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 3 GATE, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM POWER AND MEDIUM SPEED AND W/TOTEM POLE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |